Abstract: Relatively little is known about the performance of the doped Ball Grid Array (BGA) packages used in semiconductor industries, even though newer products are widely being introduced to the ...
TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates. The new line will come online in January and is designed to support high ...
Abstract: With the development of the semiconductor industry, more advanced electronic packaging solutions are being developed for improved manufacturing processes. The sparse Ball Grid Array (BGA) ...
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