Traditionally, the packaged integrated circuit (IC) has been much larger than the IC itself because standard packages must also contain the lead-frame and bond wires. That wasn’t an issue for decades ...

With all the electronic subsystems packed into today’s vehicles, testing can be tricky. Here are some switch-system design techniques to help avoid testing pitfalls. The sophistication of today’s ...

Small standalone and embedded systems — think garage door openers, electric drills, manufacturing line equipment, and medical analysis systems — typically contain an 8-bit or 16-bit microcontroller ...

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, ...

TINLEY PARK, Ill.--(BUSINESS WIRE)--Panduit Corp., the leading global provider of small diameter 28-AWG cabling solutions, has added UTP and Shielded Category 6A performance patch cords to its 28-AWG ...

Due to the ever increasing demands to drive up DC-DC power converter density, topologies that had previously been used only in high power applications are now finding their way into medium and lower ...