When Ben Wells, president of Wells R&D (Lincoln, MA), a maker of custom testing solutions for the semiconductor and optical industries, was building a test instrument, he needed to way to stack and ...
SAN DIEGO – June 2, 2022 – In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to ...
Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...
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