Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...

Olympus Integrated Technologies America presented its 3D-ICautomated metrology system at SEMICON West 2010. The system provides preciseimaging to verify the alignment of bonded wafers and TSVs ...

As semiconductor manufacturing prioritizes flexibility, innovation, and cost control, manual wafer aligners are expected to ...

When Ben Wells, president of Wells R&D (Lincoln, MA), a maker of custom testing solutions for the semiconductor and optical industries, was building a test instrument, he needed to way to stack and ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

The solar industry must work together to agree on standardised larger wafer sizes, according to monocrystalline solar manufacturer LONGi Group. The company has revealed that its H-MO4 module, which ...

Carbon nanotubes can be five times as energy efficient and five times faster than silicon. engineers at the University of Wisconsin–Madison can align the nanotubes for computer chips by turning them ...

This video shows PI’s fast multichannel photonic alignment for silicon photonics. PI is able to offer precise solutions for fiber alignment from its range of precision positioning systems, keeping ...

With a focus on parallel optimization and nanoscale accuracy, precision positioning specialist PI is streamlining the optical alignment, test and packaging of quantum photonic devices Parallel lines: ...