Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in ...

Emil Otto is aiming at joining steel, stainless steel, brass and copper objects below 450°C with three tin-based soft-soldering pastes. “The soldering and tinning pastes do not require zinc chloride, ...

Most assemblers in the electronic industry use no-clean solder paste mainly to eliminate having to clean the circuit-board assemblies. Manufacturers such as Rush PCB prefer to run all production with ...

Molded for lead-free process requirements, Multicore LF328 is a halide-free, no-clean, lead-free solder paste suitable for high-volume, stencil-printing applications with chip-scale-package lead ...

Halogen-free (ROL0): No halogen intentionally added, ensuring compliance with RoHS, RoHS 2.0, and REACH regulations. Excellent voiding performance: Minimizes void formation, enhancing solder joint ...

Through-hole chips are slowly falling by the wayside, and if you want to build something with new parts you will be using surface mount components. This means spreading paste and throwing it in the ...

When doing surface-mount assembly you can certainly use a soldering iron in the traditional way, but it’s far more convenient to cover the pads with solder paste, place the components, and bake the ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...