One high-volume OEM proves that even simple feedback from an AOI system can reduce end-of-line defects by an order of magnitude. Until recently, the use of pre-reflow optical inspection usually was ...
Ever since automated optical inspection (AOI) became a mainstay of a manufacturer's test strategy, planners have debated where to place it in the production process. Do you inspect the solder paste ...
The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...
In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process has been able to reduce the solder void size to minimum value consistently but there is an ...
Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...
Yield Engineering Systems (YES), a leading provider of process equipment for advanced packaging for AI and HPC systems, today announced that it has received multiple orders of VeroTherm™ and VeroFlex™ ...
The new pick and place machine series includes desktop, high-speed, multi-functional, LED, DOB, LED lens, and odd-shape models. Designed with advanced technology, they feature intuitive software, ...
OAKLAND, Calif.--(BUSINESS WIRE)--Digicom Electronics, Inc., a technology and quality driven electronics manufacturing services company, presents its new Diamond Track Defect Mitigation Services at ...
Interconnect technology in high bandwidth memory (HBM) is at a fork in the road. One direction leads to tried-and-true microbump technology, and the other leads to a compelling alternative, hybrid ...
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