A technical paper titled “Refined Analytical EM Model of IC-Internal Shielding for Hardware-Security and Intra-Device Simulative Framework” was published by researchers at Bar-Ilan University and ...

Electronic systems keep getting more complex. Much of the complexity comes from ICs, which can undergo years of design and validation cycles before reaching the market. System design engineering teams ...

Version 2.0b of AEi Systems’ Power IC Model Library for the Cadence PSpice simulator is now available from EMA Design Automation. Version 2.0b contains over 200 time-domain simulation models for power ...

EMA Design Automation and AEi Systems have released version 2.0b of AEi Systems’ Power IC Model Library for the Cadence PSpice simulator. EMA Design Automation and AEi Systems have released version ...

Despite the hurdles facing the independent contractors and the carriers that use them – including misclassification, higher equipment and fuel costs and new regulations – the independent contractor ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Inherited mutations of the BRCA1/2 genes confer a significantly increased risk for breast and/or ovarian cancer development. Several models were elaborated to help genetic counsellors in selecting ...