Dow Automotive Systems (Horgen, Switzerland) made big news at JEC Europe 2014 with the introduction of VORAFORCE, its ultralow-viscosity, fast-cure epoxy for automotive molding. Since then, says Peter ...

Rib parts (top) trialed using spring-frame molding (shown here, bottom, with curved C-channel part) and double diaphragm forming (DDF) processes in the DARPA-funded and Boeing co-funded RAPM program ...

Download the PDF brochure for more information about Toray's compression molded composite solutions. Toray Advanced Composites specializes in designing and developing advanced composite materials for ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Predominantly, if the metal part used in compression molding is tension or compression loaded, a ratio of metal part thickness to its extensional modulus, multiplied by the Bulk Molding Compound (BMC) ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

About 50 billion plastic screw caps are made annually, and demand is rising all the time. In the game between the two rival production processes, neither holds all the aces. When it comes to choosing ...

MONTRÉAL, March 13, 2025 /PRNewswire/ - SimForm, the leading cloud-based simulation software for mold design, is pleased to announce a significant expansion of its capabilities. Originally designed to ...

The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources. Sumitomo Bakelite, now ...