Semiconductor Engineering

Combining CMOS IC And MEMS Design For IoT Edge Devices

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved. But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a ...
Electronic Design

MEMS Hitting The Curved Ball

Many of today’s design tools ignore the specialised requirements of MEMS design. Paul Double takes a look at what’s needed. Microelectromechanical-system (MEMS) devices are moving into many fields of ...
Digi Times

China IC Design Series (3): The rise of Chinese CMOS image sensor industry

The debut of the world's first dual-camera handset in 2011 kicked off a competition between handset vendors of adding more cameras on mobile phones, pressing brand vendors including Samsung ...
EDN

Analog IC co-design for latch-up compliance

Design of power/driver ICs in compliance with latchup qualification requirements involves a conceptually different approach in comparison with digital LV (low voltage) ICs. The LV ICs’ electrostatic ...
EDN

Power management can cause latchup in CMOS chips

If you leave signals applied to the inputs of a CMOS chip with the power turned off, the chip might explode when you re-apply power. This is called latchup. Similarly, if you drag the outputs of a ...
Semiconductor Engineering

Fusing CMOS IC And MEMS Design For IoT Edge Devices

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved (Analog, digital, RF, and MEMS). But, creating an edge device that combines the electronics using ...
Electronic Design

Fusing CMOS IC and MEMS Design for IoT Edge Devices

Designers are now creating IoT edge devices that span across analog, digital, RF, and MEMS domains. They are tackling a challenge that once seemed impossible: combining the electronics of the device ...