The 3D NAND Flash Memory Market is driven by increasing demand for higher storage capacities in smartphones, laptops, and data centers. Advancements in AI and IoT, requiring robust data storage ...
Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
Featuring Kioxia Corporation’s latest BiCS FLASH generation 8 3D flash memory with innovative CBA technology, the BG7 Series ...
KIOXIA's new consumer-facing BG7 Series adopts the company's latest BiCS FLASH Gen 8 3D technology, and arrives at the ...
Morning Overview on MSN
This new 3D chip could smash the 'memory wall' slowing AI
Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...
Morning Overview on MSN
This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...
Whether being built for capacity or capability, the conventional wisdom about memory provisioning on the world’s fastest systems is changing quickly. The rise of 3D memory has thrown a curveball into ...
Three-dimensional (3D) memory integration marks a significant advancement in semiconductor technology, enabling higher device densities and enhanced performance for modern applications. However, the ...
From Q-bits to NAND flash, small integrated electronic devices are shaping the future. The 2017 IEEE IEDM Conference was a great place to get a view of the advances that will power future electronics, ...
Like many system architects the world over, we had high hopes for the 3D XPoint variant of phase change memory (PCM) when it launched with much fanfare back in July 2015 after being developed jointly ...
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